All the IC Package Data in One Place: QFP, QFN, BGA, and WLCSP

This is the fifth blog post in our series about the miniaturization of IC packages. In Part 1, we provided an overview of the four common IC packages: Quad Flat Package (QFP), Quad Flat No Lead (QFN), Ball Grid Array (BGA), and Wafer Level Chip Scale Packaging (WLCSP). In Part 2, we examined the transition from QFP to QFN, analyzing 44 unique QFP packages and 35 unique QFN packages. In Part 3, we focused on the transition to BGA, analyzing 105 unique BGA packages. In Part 4, we look at 271 unique WLCSP packages. We used the theoretical limits of contact density to illustrate why the shift to BGA and WLCSP was necessary as ICs became smaller and more complex.

Origin of this series

This series emerged from a desire to create a quick chart (as seen above) showing the range of contact density between quad flat packages (QFP), quad flat no-lead packages (QFN), and ball grid array packages (BGA). Originally, this post was intended to be a brief explainer of each package type. However, while attempting to compile data for the chart showing contact densities for each package technology, it became clear that even though I had spent a decade designing PCBs with these packages, I had only really worked with about thirty to forty of them.

I believe most electrical engineers are in the same position: we understand the basic concepts of each package and have seen a variety of them, but we’ve never taken the time to thoroughly explore the full range of QFP, QFN, BGA, and WLCSP packages. What was supposed to be a simple graph quickly morphed into a multi-month research project and a series of blog posts.

Data Collection

All of the data in this series was collected directly from datasheets provided by the component manufacturers. We used DigiKey as our primary search tool for these packages. The data was collected by first searching for the desired type of package— QFP, QFN, BGA, or WLCSP —and then focusing on the three product categories with the most results.

Within each product category, we reviewed each “Package/Case” to find a component with a datasheet that contained a package drawing.

The data was then entered into the data sheet of our Excel file.

The Data Set

This is the final set of packages we ended up with by the conclusion of our blog series.

Get More Information

Part 1: Miniaturization of IC Packages

Part 2: Exploring IC Package Miniaturization: QFP and QFN

Part 3: The move from QFN and QFP to Ball Grid Array

Part 4: The Rise of Wafer Level Chip Scale Packages (WLCSP)

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